CVD systems can be classified into several types based on the method of energy input and pressure:
Thermal CVD: Uses heat to activate the chemical reactions. Plasma-Enhanced CVD (PECVD): Utilizes plasma to enhance the reaction rates at lower temperatures. Low-Pressure CVD (LPCVD): Operates under reduced pressure to improve film uniformity and step coverage. Metal-Organic CVD (MOCVD): Employs metal-organic precursors, often used for compound semiconductors.
