There are primarily two types of break junction techniques:
Mechanically Controlled Break Junction (MCBJ): This technique uses a bending beam to mechanically control the breaking of a metallic wire. It offers high stability and control over the junction formation. Electromigrated Break Junction (EBJ): In this method, a high electric current is passed through a metallic wire to induce electromigration, leading to the formation of a nanogap. This technique is useful for creating gaps in thin films and can be integrated with other electronic devices.
