Several parameters influence the etching process, including:
Etching Rate: The speed at which material is removed. It is crucial for controlling the depth and uniformity of the etch. Etch Selectivity: The ratio of the etch rate of the target material to that of the masking material. High selectivity ensures that the mask remains intact while the target material is etched. Etching Uniformity: Consistency of the etching process across the entire substrate. Uniformity is essential for producing reliable nanostructures. Temperature: Higher temperatures can increase the etching rate but may also affect the selectivity and uniformity. Pressure: In dry etching, the pressure of the gas or plasma can significantly impact the etching characteristics.
