What are the Key Challenges in Implementing Vertical Interconnects?
Despite their advantages, there are several challenges in implementing vertical interconnects:
1. Thermal Management: The increased density of 3D ICs leads to higher power densities, necessitating efficient heat dissipation solutions. 2. Fabrication Complexity: Creating TSVs involves precise etching and filling processes, which can be complex and costly. 3. Electromigration: The reliability of TSVs can be compromised by electromigration, especially as the dimensions shrink further in nanoscale applications.
