What are the Challenges in Achieving Reduced Undercutting?
While the benefits of reduced undercutting are clear, several challenges must be addressed:
- Material Compatibility: Finding etching chemistries and mask materials that are compatible with the target substrate can be complex.
- Process Complexity: Techniques like anisotropic etching and hard masking add layers of complexity to the fabrication process, which can increase costs and time.
- Uniformity and Reproducibility: Ensuring uniform etching across large wafers and reproducibility between batches can be difficult.
