The process begins by placing the target material and the substrate in a vacuum chamber. An RF power source is then used to ionize the gas (often argon) within the chamber, creating a plasma. The ions in the plasma collide with the target material, causing atoms to be sputtered off. These atoms travel through the chamber and deposit onto the substrate, forming a thin film. The use of RF power allows for the deposition of insulating as well as conducting materials, making it highly versatile.
