The fabrication of transistor layers involves advanced techniques such as lithography, chemical vapor deposition (CVD), and atomic layer deposition (ALD). These methods allow for the precise placement and formation of nanometer-scale structures. Key steps in the fabrication process include:
Substrate Preparation: The base material, usually silicon, is prepared to serve as the foundation for transistor layers. Material Deposition: Layers of semiconducting materials are deposited onto the substrate using CVD or ALD techniques. Patterning: Lithography is used to pattern the layers, defining the regions where transistors will be formed. Etching: Unwanted material is removed through etching, leaving behind the desired transistor structures. Doping: The semiconductor material is doped with impurities to modify its electrical properties. Layer Stacking: Multiple layers are stacked to form complex, multi-layered transistor structures.
