Photolithography: This technique uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical photoresist on the substrate. It is widely used in the semiconductor industry for fabricating integrated circuits.
Electron-Beam Lithography (EBL): EBL employs a focused beam of electrons to create extremely fine patterns. It offers higher resolution than photolithography but is generally slower and more expensive.
Nanoimprint Lithography (NIL): NIL involves mechanically deforming a resist using a mold to create nanoscale patterns. It is a cost-effective method for high-throughput production.
Self-Assembly: This technique leverages the natural tendency of molecules to organize into structured patterns. It is particularly useful for creating complex nanostructures without the need for advanced equipment.
Atomic Layer Deposition (ALD): ALD is a thin film deposition technique that allows for precise control over film thickness and composition at the atomic level.
Scalability: Many nanofabrication techniques are not yet suitable for large-scale production, making it difficult to transition from research to commercial applications.
Cost: The equipment and materials required for nanofabrication are often expensive, which can be a barrier to widespread adoption.
Precision and Control: Achieving consistent and precise control over nanoscale features is challenging and requires advanced techniques and equipment.
Material Limitations: Not all materials can be easily manipulated at the nanoscale, limiting the range of potential applications.