Lead Free Solders - Nanotechnology

Relevant Publications

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.

Issue Release: 2024

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review.

Issue Release: 2024

Laser Thermal Wave Diagnostics of the Thermal Resistance of Soldered and Bonded Joints in Semiconductor Structures.

Issue Release: 2023

Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions.

Issue Release: 2023

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review.

Issue Release: 2022

Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization.

Issue Release: 2022

Co-digestive ripening assisted phase-controlled synthesis of Ag-Sn intermetallic nanoparticles and their dye degradation activity.

Issue Release: 2022

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.

Issue Release: 2021

Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy.

Issue Release: 2021

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate.

Issue Release: 2021

Thermal Cycling of (RE)BCO-Based Superconducting Tapes Joined by Lead-Free Solders.

Issue Release: 2021

Structure and properties of Sn-Cu lead-free solders in electronics packaging.

Issue Release: 2019

A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders.

Issue Release: 2019

Atomistic analysis of the thermomechanical properties of Sn-Ag-Cu solder materials at the nanoscale with the MEAM potential.

Issue Release: 2019

Solid State Phase Equilibria of an Al⁻Sn⁻Y Ternary System.

Issue Release: 2019

Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis.

Issue Release: 2019

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints.

Issue Release: 2019

Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions.

Issue Release: 2018

Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications.

Issue Release: 2018

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder.

Issue Release: 2017

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