Chemical Mechanical Planarization (cmp) - Nanotechnology

Relevant Publications

Optimization of Graphical Parameter Extraction Algorithm for Chip-Level CMP Prediction Model Based on Effective Planarization Length.

Issue Release: 2024

Abrasive-free chemical-mechanical planarization (CMP) of gold for thin film nano-patterning.

Issue Release: 2024

Characterization of Ceria Nanoparticles as Abrasives Applied with Defoaming Polymers for CMP (Chemical Mechanical Polishing) Applications.

Issue Release: 2024

Two decades of ceria nanoparticle research: structure, properties and emerging applications.

Issue Release: 2024

Novel Probability Density Function of Pad Asperity by Wear Effect over Time in Chemical Mechanical Planarization.

Issue Release: 2024

Oxidation differences on Si- versus C-terminated surfaces of SiC during planarization in the fabrication of high-power, high-frequency semiconductor device.

Issue Release: 2023

Nondestructive monitoring of annealing and chemical-mechanical planarization behavior using ellipsometry and deep learning.

Issue Release: 2023

Polymer Nanoparticles Applied in the CMP (Chemical Mechanical Polishing) Process of Chip Wafers for Defect Improvement and Polishing Removal Rate Response.

Issue Release: 2023

Benzethonium chloride as a tungsten corrosion inhibitor in neutral and alkaline media for the post-chemical mechanical planarization application.

Issue Release: 2023

Piezocatalysis for Chemical-Mechanical Polishing of SiC: Dual Roles of t-BaTiO as a Piezocatalyst and an Abrasive.

Issue Release: 2023

Research of Vertical via Based on Silicon, Ceramic and Glass.

Issue Release: 2023

Semi-Supervised Deep Kernel Active Learning for Material Removal Rate Prediction in Chemical Mechanical Planarization.

Issue Release: 2023

The Effects of Friction and Temperature in the Chemical-Mechanical Planarization Process.

Issue Release: 2023

Active Probe Atomic Force Microscopy with Quattro-Parallel Cantilever Arrays for High-Throughput Large-Scale Sample Inspection.

Issue Release: 2023

Surface Transformation of Spin-on-Carbon Film via Forming Carbon Iron Complex for Remarkably Enhanced Polishing Rate.

Issue Release: 2022

Polymer link breakage of polyimide-film-surface using hydrolysis reaction accelerator for enhancing chemical-mechanical-planarization polishing-rate.

Issue Release: 2022

Coupling Supramolecular Assemblies and Reactive Oxygen Species (ROS) with Megasonic Action for Applications in Shallow Trench Isolation (STI) Post-Chemical Mechanical Planarization (p-CMP) Cleaning.

Issue Release: 2022

Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films.

Issue Release: 2022

Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies.

Issue Release: 2022

A Resonant Pressure Microsensor with a Wide Pressure Measurement Range.

Issue Release: 2021

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