3d integrated circuits

How do 3D ICs differ from traditional ICs?

The primary difference lies in the vertical stacking of layers in 3D ICs, as opposed to the planar layout of traditional ICs. This allows for shorter interconnect lengths, which can improve speed and reduce power consumption. Additionally, 3D ICs can integrate different types of technologies (e.g., memory and logic) within the same chip, enhancing functionality.

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