The fabrication of nano electronic components involves several advanced techniques:
Top-Down Approaches: Techniques like photolithography and electron-beam lithography are used to etch patterns onto a substrate. Bottom-Up Approaches: Methods such as chemical vapor deposition (CVD) and molecular self-assembly are employed to build structures atom by atom or molecule by molecule. Hybrid Approaches: Combining both top-down and bottom-up techniques to optimize performance and scalability.
